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| NLAS324 Dual SPST Analog Switch, Low Voltage, Single Supply The NLAS324 is a dual SPST (Single Pole, Single Throw) switch, similar to 1/2 a standard 4066. The device permits the independent s e l e c t i o n o f 2 a n a l o g / d i g i t a l s i g n a l s . Av a i l a b l e i n t h e Ultra-Small 8 package. The use of advanced 0.6 m CMOS process, improves the RON resistance considerably compared to older higher voltage technologies. Features http://onsemi.com MARKING DIAGRAM 8 US8 US SUFFIX CASE 493 1 1 A7 = Device Code M = Date Code* G = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. * * * * * * * * * * * * On Resistance is 20 W Typical at 5.0 V Matching is t W Between Sections 2 - 6 V Operating Range Ultra Low t 5 pC Charge Injection Ultra Low Leakage t 1 nA at 5.0 V, 25C Wide Bandwidth u 200 MHz, -3 dB 2000 V ESD (HBM) Ron Flatness $ 6 W at 5.0 V US8 Package Negative Enable Switches are Independent Pb-Free Package is Available 8 A7 M G G PIN ASSIGNMENT 1 2 3 NC1 COM1 IN2 GND NC2 COM2 IN1 VCC NC1 1 8 VCC 4 5 6 COM1 2 7 IN1 7 8 IN2 3 6 COM2 FUNCTION TABLE On/Off Enable Input L H State of Analog Switch On Off GND 4 5 NC2 Figure 1. Pinout ORDERING INFORMATION Device NLAS324US NLAS324USG Package US8 US8 (Pb-Free) Shipping 3,000 / Tape & Reel 3,000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2006 1 April, 2006 - Rev. 7 Publication Order Number: NLAS324/D NLAS324 MAXIMUM RATINGS Symbol VCC VI VO IIK IOK IO ICC IGND TSTG TL TJ qJA PD MSL FR VESD DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current DC Supply Current per Supply Pin DC Ground Current per Ground Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature under Bias Thermal Resistance (Note 1) Power Dissipation in Still Air at 85_C Moisture Sensitivity Flammability Rating Oxygen Index: 28 to 34 ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) VI < GND VO < GND Parameter Value *0.5 to )7.0 *0.5 to )7.0 *0.5 to )7.0 *50 *50 $50 $100 $100 *65 to )150 260 )150 250 250 Level 1 UL 94 V-0 @ 0.125 in > 2000 > 150 N/A V Unit V V V mA mA mA mA mA _C _C _C _C/W mW Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2-ounce copper trace with no air flow. 2. Tested to EIA/JESD22-A114-A. 3. Tested to EIA/JESD22-A115-A. 4. Tested to JESD22-C101-A. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VIO VIS TA tr, tf Positive DC Supply Voltage Digital Input Voltage (Enable) Static or Dynamic Voltage Across an Off Switch Analog Input Voltage (NO, COM) Operating Temperature Range, All Package Types Input Rise or Fall Time, (Enable Input) Vcc = 3.3 V + 0.3 V Vcc = 5.0 V + 0.5 V NORMALIZED FAILURE RATE Characteristics Min 2.0 GND GND GND -55 0 0 Max 5.5 5.5 VCC VCC +125 100 20 Unit V V V V C ns/V DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature 5C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0 FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130_C TJ = 120_C TJ = 100_C TJ = 110_C TJ = 90_C TJ = 80_C 100 TIME, YEARS 1 1 10 1000 Figure 2. Failure Rate vs. Time Junction Temperature http://onsemi.com 2 NLAS324 DC CHARACTERISTICS - Digital Section (Voltages Referenced to GND) Guaranteed Max Limit Symbol VIH Parameter Minimum High-Level Input Voltage, Enable Inputs Condition VCC 2.0 3.0 4.5 5.5 2.0 3.0 4.5 5.5 VIN = 5.5 V or GND Enable and VIS = VCC or GND 0 V to 5.5 V 5.5 -55 to 255C 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 +0.1 1.0 <855C 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 +1.0 1.0 <1255C 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 +1.0 2.0 Unit V VIL Maximum Low-Level Input Voltage, Enable Inputs V IIN ICC Maximum Input Leakage Current, Enable Inputs Maximum Quiescent Supply Current (per package) mA mA DC ELECTRICAL CHARACTERISTICS - Analog Section Guaranteed Max Limit Symbol RON Parameter Maximum ON Resistance (Figures 8 - 12) ON Resistance Flatness Condition VIN = VIH VIS = VCC to GND IIsI = <10.0mA VIN = VIH IIsI = <10.0mA VIS = 1V, 2V, 3.5V VIN = VIL VNO = 1.0 V, VCOM = 4.5 V or VCOM = 1.0 V and VNO 4.5 V VIN = VIL VNO = 4.5 V or 1.0 V VCOM = 1.0 V or 4.5 V VCC 3.0 4.5 5.5 4.5 -55 to 255C 45 30 25 4 <855C 50 35 30 4 <1255C 55 40 35 5 Unit W RFLAT(ON) W INO(OFF) Off Leakage Current, Pin 2 (Figure 3) Off Leakage Current, Pin 1 (Figure 3) 5.5 1 10 100 nA ICOM(OFF) 5.5 1 10 100 nA AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Guaranteed Max Limit VCC Symbol tON Parameter Turn-On Time Test Conditions RL = 300 W, CL = 35 pF (Figures 4, 5, and 13) (V) 2.03.04.55.5 -55 to 255C Min Typ 7.0 5.0 4.5 4.5 11.0 7.0 5.0 5.0 Max 14 10 9 9 22 14 10 10 Min <855C Typ Max 16 12 11 11 24 16 12 12 Min <1255C Typ Max 16 12 11 11 24 16 12 12 Unit ns tOFF Turn-Off Time RL = 300 W, CL = 35 pF (Figures 4, 5, and 13) 2.03.04.5 5.5 ns Typical @ 25, VCC = 5.0 V CIN CNO or CNC CCOM(OFF) CCOM(ON) Maximum Input Capacitance, Select Input Analog I/O (switch off) Common I/O (switch off) Feedthrough (switch on) 8 10 10 20 pF http://onsemi.com 3 NLAS324 ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted) VCC Symbol BW Parameter Maximum On-Channel -3dB Bandwidth or Minimum Frequency Response Maximum Feedthrough On Loss Condition VIS = 0 dBm VIS centered between VCC and GND (Figures 6 and 14) VIS = 0 dBm @ 10 kHz VIS centered between VCC and GND (Figure 6) f = 100 kHz; VIS = 1 V RMS VIS centered between VCC and GND (Figures 6 and 15) VIS = VCC to GND, FIS = 20 kHz tr = tf = 3 ns RIS = 0 W, CL = 1000 pF Q = CL * DVOUT (Figures 7 and 16) FIS = 20 Hz to 1 MHz, RL = Rgen = 600 W, CL = 50 pF VIS = 3.0 VPP sine wave VIS = 5.0 VPP sine wave (Figure 17) V 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 5.5 Limit 25C 190 200 220 -2 -2 -2 -93 Unit MHz VONL dB VISO Off-Channel Isolation dB Q Charge Injection Enable Input to Common I/O 1.5 3.0 pC THD Total Harmonic Distortion THD + Noise 3.3 5.5 0.3 0.15 % 1.00E+05 1.00E+04 1.00E+03 1.00E+02 1.00E+01 1.00E+00 1.00E-01 1.00E-02 1.00E-03 1.00E-04 1.00E-05 1.00E-06 1.00E-07 LEAKAGE (pA) ICOM(ON) ICOM(OFF) INO(OFF) 5 25 45 65 85 105 125 145 -55 -35 -15 TEMPERATURE (C) Figure 3. Switch Leakage vs. Temperature VCC DUT VCC 0.1 mF 300 W NO COM VOUT 35 pF Output VOL tON tOFF Input 0V VOH 90% 90% 50% 50% Input Figure 4. tON/tOFF http://onsemi.com 4 NLAS324 VCC DUT NO COM 35 pF Output 10% VOL Input tOFF tON 10% 300 W VOUT Input 0V VOH VCC 50% 50% Figure 5. tON/tOFF Reference COM DUT Transmitted NO 50 W Generator 50 W Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. VISO = Off Channel Isolation = 20 Log VONL = On Channel Loss = 20 Log VOUT for VIN VIN at 100 kHz VOUT for V at 100 kHz to 50 MHz VIN IN Bandwidth (BW) = the frequency 3 dB below VONL Figure 6. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL DUT NO COM CL Output VIN VCC GND Off VIN On Off DVOUT Figure 7. Charge Injection: (Q) http://onsemi.com 5 NLAS324 80 70 60 RON (W) 50 RON (W) 40 30 20 10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 VCOM (VOLTS) VCC = 2.5 VCC = 3.0 VCC = 4.5 10 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 VIS (VOLTS) 125C VCC = 2.0 80 70 60 50 40 30 25C 20 85C -55C Figure 8. RON vs. VCOM and VCC (@255C) Figure 9. RON vs. VCOM and Temperature, VCC = 2.0 V 45 40 35 30 RON (W) 25 20 15 10 5 0 0 125C 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 85C -55C 25C RON (W) 30 25 20 15 10 5 0 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 VCOM (VOLTS) 125C 25C 85C -55C VCOM (VOLTS) Figure 10. RON vs. VCOM and Temperature, VCC = 2.5 V Figure 11. RON vs. VCOM and Temperature, VCC = 3.0 V 35.0 18 16 14 RON (W) 12 10 8 6 4 2 0 0 0.4 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 VCOM (VOLTS) 125C TIME (nS) 85C 30.0 25C -55C 25.0 20.0 15.0 10.0 5.0 tOFF 0.0 2.0 3.0 4.5 VCC (V) 5.0 5.5 tON Figure 12. RON vs. VCOM and Temperature, VCC = 4.5 V Figure 13. Switching Time vs. Supply Voltage, T = 255C http://onsemi.com 6 NLAS324 0 10 Bandwidth (On - Loss) OFF ISOLATION (dB/Div) 0 BANDWIDTH (dB/Div) Phase (Degrees) 5 PHASE (Degrees) 0 -50 VCC = 5.0 V TA = 25C VCC = 5.0 V TA = 25C 0.01 0.1 1 10 100 300 -100 0.01 0.1 1 FREQUENCY (MHz) 10 100 300 FREQUENCY (MHz) Figure 14. ON Channel Bandwidth and Phase Shift Over Frequency Figure 15. Off Channel Isolation 1.60 1.40 1.20 1.00 Q (pC) 0.80 0.60 0.40 0.20 0.00 0.0 VCC = 3.0 V VCC = 5.0 V 100 10 THD (%) 1 3.3 V 0.1 5.5 V 0.01 1.0 2.0 3.6 3.0 VCOM (V) 4.0 4.5 5.0 10 100 1000 10000 100000 1000000 FREQUENCY (Hz) Figure 16. Charge Injection vs. VCOM Figure 17. THD vs. Frequency http://onsemi.com 7 NLAS324 CAVITY TAPE TOP TAPE TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN COMPONENTS DIRECTION OF FEED TAPE LEADER NO COMPONENTS 400 mm MIN Figure 18. Tape Ends for Finished Goods TAPE DIMENSIONS mm 2.00 4.00 4.00 1.50 TYP 1.75 8.00 + 0.30 - 0.10 3.50 $ 0.25 1 1.00 0.25 TYP DIRECTION OF FEED Figure 19. US8 Reel Configuration/Orientation http://onsemi.com 8 NLAS324 t MAX 1.5 mm MIN (0.06 in) 20.2 mm MIN (0.795 in) 13.0 mm $0.2 mm (0.512 in $0.008 in) A 50 mm MIN (1.969 in) FULL RADIUS G Figure 20. Reel Dimensions REEL DIMENSIONS Tape Size 8 mm T and R Suffix US A Max 178 mm (7 in) G 8.4 mm, + 1.5 mm, -0.0 (0.33 in + 0.059 in, -0.00) t Max 14.4 mm (0.56 in) DIRECTION OF FEED BARCODE LABEL POCKET HOLE Figure 21. Reel Winding Direction http://onsemi.com 9 NLAS324 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493-02 ISSUE B J -X- A 8 5 -Y- DETAIL E B L 1 4 R S U C H 0.10 (0.004) T TXY V M N R 0.10 TYP P G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION "A" DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055") PER SIDE. 4. DIMENSION "B" DOES NOT INCLUDE INTER-LEAD FLASH OR PROTRUSION. INTER-LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055") PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076-0.0203 MM. (300-800 "). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED 0.0508 (0.0002 "). MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC -T- SEATING PLANE D 0.10 (0.004) K M F DETAIL E DIM A B C D F G H J K L M N P R S U V SOLDERING FOOTPRINT* 3.8 0.15 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 10 NLAS324/D |
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